Joint Presentation with Resonac on Technology to Enhance Productivity and Reliability of Advanced Packaging at an International Conference

KOKUSAI ELECTRIC CORPORATION (President and CEO: Kazunori Tsukada, Head Office: Chiyoda-ku, Tokyo, Japan) announced that it jointly presented with Resonac Corporation (hereinafter, “Resonac”) at the 23rd International Symposium on Microelectronics and Packaging, an international conference on semiconductor packaging technology held in Daegu, Korea, from Tuesday, November 4 to Friday, November 7. The presentation introduced a technology that improves both productivity and reliability in advanced semiconductor device packaging.

This joint presentation with Resonac demonstrated that, by homogenizing the internal surfaces of advanced semiconductor device packages composed of complex material structures through film formation by ALD*¹ followed by continuous surface treatment, the surface wettability of the devices can be quantitatively controlled, thereby enabling adjustment of the flow rate of underfill materials. By homogenizing diverse surface conditions via ALD film deposition and quantitatively controlling the surface wettability through subsequent surface treatment, the flow characteristics of underfill materials are improved, void formation is suppressed, and filling time is shortened, thereby enhancing overall productivity. In addition, it was confirmed that reliability is further improved by enhancing adhesion to underfill materials through hydrophilic surface treatment. This approach is expected to contribute to shorter filling time in the underfill process and to improved reliability and yield of packaging, even for large chips, fine-pitch interconnections, and heterogeneous integration structures.

Under the corporate slogan “Technology & Tai-wa for Tomorrow,” we will pursue economic, environmental, and social values from both business and ESG initiatives (resolving environmental and social issues and strengthening governance), with the aim of contributing to the achievement of SDGs and realizing a sustainable society and our group’s sustainable development.