TRANSLATION - FOR REFERENCE ONLY -
September 25, 2025
KOKUSAI ELECTRIC CORPORATION (President and CEO: Kazunori Tsukada, Head Office: Chiyoda-ku, Tokyo, Japan) has entered into a joint development agreement with ASMPT Limited (Headquarters: Singapore, hereinafter referred to as “ASMPT”), which provides hardware and software solutions for semiconductor and SMT*1 manufacturing, regarding hybrid bonding*2 and TCB bonding*3 in semiconductor packaging technology.
Through the joint development agreement concluded this time, we aim to develop optimal solutions in the field of semiconductor 2.5D and 3D packaging, which are expected to be utilized for next-generation high-performance computing (HPC) and AI. This will be achieved by combining our advanced thin-film formation technology, which is our strength, with ASMPT’s high-precision bonding technology.
Comment from Hidehiro Yanagawa, Executive Director, Executive Vice President and Executive Officer, KOKUSAI ELECTRIC CORPORATION
By integrating our state-of-the-art thin-film technology with ASMPT’s precision bonding platforms, we are addressing critical advanced packaging process challenges and setting new industry benchmarks for both hybrid bonding and thermo-compression bonding.
Comment from Mr. Nelson Fan, VP of Advanced Packaging Business Group, ASMPT SEMI Solutions
Our partnership with KOKUSAI ELECTRIC will truly push the boundaries of advanced packaging technology. Through this close collaboration, we are looking forward to unlocking further possibilities with our patented AOR TCB™ (the process with our FIREBIRD bonder), and our cutting-edge LITHOBOLT® hybrid bonding platform, to deliver robust, scalable, and high-quality solutions for the future.
Under the corporate slogan “Technology & Tai-wa for Tomorrow,” we will pursue economic, environmental, and social values from both business and ESG (resolving environmental and social issues and strengthening governance) aspects, with the aim of contributing to the achievement of SDGs and realizing a sustainable society and our group’s sustainable development.
- *1
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Abbreviation for surface mount technology, a technique for directly mounting electronic components onto the surface of printed circuit boards
- *2
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A semiconductor packaging technology that directly bonds different semiconductor chips or wafers
- *3
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A type of flip-chip bonding technology where heat and pressure are applied to bond electrodes when mounting a semiconductor chip onto a substrate