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Deposition Process Equipment

Deposition process equipment forms nanoscale thin film to make circuits on wafers.
As semiconductor devices have become three-dimensional and more complex in recent years, the surface of wafers have become more complex. This in turn has increased demand for highly difficult deposition. 

Our deposition process equipment supports LP-CVD*1, oxidation, annealing (low and high temperature), diffusion, and ALD*2 technologies, and has earned high acclaim from semiconductor device manufacturers worldwide.

*1. Low Pressure Chemical Vapor Deposition
*2. We refer to a technique for thin-film deposition at an atomic layer level involving a process of cyclical supply of multiple gases as “ALD”.

  • TSURUGI-C²® 剱®
    Mini Batch Deposition Equipment

    TSURUGI-C²® 剱®

    Process Applications

    • Thin film deposition

    TSURUGI-C²® is a KOKUSAI ELECTRIC’s new thermal processing platform which is most recently developed for advanced devices especially for the ones with high aspect ratio 3D structures requiring high quality, uniform and conformal film deposition with new innovative reactor design and process techniques.

  • AdvancedAce®-300
    Large Batch Deposition Equipment

    AdvancedAce®-300

    Process Applications

    • LP CVD

    • Oxidation

    • Annealing (low/high temp.)

    • Diffusion

    AdvancedAce®-300 is a KOKUSAI ELECTRIC’s latest platform for batch thermal processing of 300mm wafers.
    The AA-300 offers high throughput by utilizing advanced technologies in such areas as temperature control, wafer handling automation, reactor purging.

  • VERTRON® Revolution
    Large Batch Deposition Equipment

    VERTRON® Revolution

    Process Applications

    • LP CVD

    • Oxidation

    • Annealing (low/high temp.)

    • Diffusion

    “VERTRON® Revolution” is the latest product in our proven VERTRON® series of 200-mm batch thermal processing systems. Customers can choose from a variety of models to suit their needs — from high-mix low-volume production to mass production. It is also compatible with 150-mm or smaller wafers.

Treatment (film property improvement) Process Equipment

Treatment process equipment improves film properties by applying plasma and heat on thin film to remove impurities from film and stabilize particles. 
As semiconductor devices have become more minute and complex in recent years, demand has grown for treatment technology that can improve film properties in low-temperature environments. 
Our treatment equipment supports nitridation, oxidation, curing, and annealing, and has earned high acclaim from semiconductor device manufacturers worldwide. 

  • MARORA®
    Single Wafer Treatment Equipment

    MARORA®

    Process Applications

    • Plasma nitridation (nitridation of dielectric film)

    • Plasma oxidation (thin oxide film formation, selective oxidation, and anisotropic oxidation)

    MARORA® is the ideal tool for forming gate dielectric film to make next-generation DRAM, logic chips, and flash memory.
    Utilizing our proprietary plasma generation method (MMT*), MARORA® generates plasma with low electron temperature (approx. 1eV) efficiently and achieves plasma damage-free processing.

  • TANDUO®
    Single Wafer Treatment Equipment

    TANDUO®

    Process Applications

    • Low temp. annealing

    • Curing

    TANDUO®'s modular design enables you to create the optimal system to suit your specific processing needs. Select modules to accommodate a variety of processes, such as curing, annealing, and degassing. This combined with our proprietary high-speed wafer transfer system will enable you to achieve highly productive, low-particle processing.

  • AdvancedAce®-300
    Large Batch Treatment Equipment

    AdvancedAce®-300

    Process Applications

    • LP CVD

    • Oxidation

    • Annealing (low/high temp.)

    • Diffusion

    AdvancedAce®-300 is a KOKUSAI ELECTRIC’s latest platform for batch thermal processing of 300mm wafers.
    The AA-300 offers high throughput by utilizing advanced technologies in such areas as temperature control, wafer handling automation, reactor purging.

Measuring Systems

Ultrasonic Generators